--Align Technology, Inc. today announced that the U.S. Food and Drug Administration has cleared the award winning iTero Element 5 D Imaging System for commercial availability in the United States ...

By deploying cutting-edge lasers and a little problem-solving, scientists at the University of Southampton have achieved a data storage breakthrough that offers both incredible density and long ...

The iTero Element 5D, the latest innovation in the iTero product portfolio, is the first integrated dental imaging system that simultaneously records 3D intra-oral optical impressions, 2D color ...

Broadcom's 3.5D XDSiP platform for high-performance processors uses TSMC's CoWoS and other packaging technologies to build a system-in-packages comprising 6000mm² of 3D-stacked silicon with 12 ...

Broadcom introduces 3.5D XDSiP chip packaging for data center processors - SiliconANGLESiliconANGLE Media is a recognized leader in digital media innovation, uniting breakthrough technology ...

Using high-speed lasers, researchers have created "5D" data storage technology that could allow 500 TB of data to be written to a CD-sized glass disc.

Broadcom (AVGO) announced the availability of its 3.5D eXtreme Dimension System in Package platform technology, enabling consumer AI customers to develop next-generation custom accelerators. The 3 ...

QDay Technology, an expert in GUI software development, has joined VeriSilicon’s watch graphical user interface (GUI) ecosystem.

The GLOBALFOUNDRIES 2.5D technology addresses the challenges of multi-die integration with solutions for front-end steps such as via-middle TSV creation, and flexibility for the backend steps ...