With continuous device scaling, process windows have become narrower and narrower due to smaller feature sizes and greater process step variability [1]. A key task during the R&D stage of ...
If a lot of the buzz at SPIE last week came from the packed sessions on EUV technology, a lot of the serious note-taking was done at the papers on double-patterning. Not least among the sources of ...
To extend 193-nm lithography to next-generation semiconductors, Round Rock, Texas-based photomask provider Toppan Photomasks Inc. and Grenoble, France-based technology R&D organization Electronics and ...
Applied is working with all leading-edge logic chipmakers on a growing number of applications for its Sculpta ® pattern-shaping technology Introducing innovative new etch systems, CVD patterning films ...
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