The move away from monolithic SoCs to heterogeneous chips and chiplets in a package is accelerating, setting in motion a broad shift in methodologies, collaborations, and design goals that are felt by ...
This review article, authored by Dr. Weidong Zhang’s team from Shanghai Jiao Tong University, was recently published in the journal Robot Learning. Focusing on the increasingly prominent topic of ...
Modern semiconductor components are becoming more and more complex and cost sensitive. To master technological and economic challenges, new chiplet approaches and heterogeneous integration ...
In industry, we see more and more examples of systems being built through heterogeneous integration leveraging 2.5D or 3D connectivity. In this interview, Eric Beyne, Senior Fellow, VP R&D and Program ...
In industry, we see more and more examples of systems being built through heterogeneous integration leveraging 2.5D or 3D connectivity. In this interview, Eric Beyne, Senior Fellow, VP R&D and Program ...
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