First order process modeling can help tremendously with process setup and integration challenges that occur in a semiconductor fabrication flow, by visualizing process variation problems “virtually” ...

As silicon photonics manufacturing gains momentum with additional foundry and 300mm offerings, process variation issues are coming to light. Variability in silicon processing affects the waveguide ...

Copper interconnect was introduced to the mainstream at 130nm because of its significant advantages compared to aluminum, such as reduction in resistivity and power consumption and resistance to ...

In the past decade, chemical-mechanical polishing (CMP) has emerged as the predominant planarization technique for shallow trench isolation (STI) and back end of the line (BEOL) metallization. To ...

Use of machine learning and feed-forward neural networks presents a new and exciting opportunity to develop high-accuracy CMP models of complex, advanced deposition processes. Machine learning (ML), ...

Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of ...