PITTSBURGH, Oct. 24, 2019 /PRNewswire/ -- ANSYS (NASDAQ: ANSS), the global leader and innovator of engineering simulation software, announced today that it has entered into a definitive agreement to ...

New integration and patterning schemes used in 3D memory and logic devices have created manufacturing and yield challenges. Industrial focus has shifted from the scaling of predictable unit processes ...

The researchers explore the optimization and integrated application of artificial intelligence (AI) in the manufacturing of ...

InstaLOD 2026 simplifies and scales 3D asset preparation, helping teams move from source data to production-ready ...

San Jose, Calif. — The addition of nonvolatile memory to a system-level IC is never an easy proposition. Often, design teams take the easy way out and simply put flash in an external chip. If ...

Nowadays, to have the edge over competitors, modern manufacturing automation systems have to be employed. They consist of Information Technology (IT) and control systems at business and process levels ...

Desktop Metal’s cash balance combined with the impacts from the integration and cost optimization initiative announced today provides the Company with a strong liquidity position to reach breakeven on ...

Advanced CMOS scaling and new memory technologies have introduced increasingly complex structures into the device manufacturing process. For example, the increase in NAND memory layers has achieved ...

Multifidelity optimization can inform decision-making during process development and reduce the number of experiments ...