A research team led by German research center Forschungszentrum Jülich GmbH has proposed to use direct wire bonding (DWB) as a low-temperature method for interconnecting finger-free heterojunction ...
Researchers at the University of New South Wales have used a 1 µm copper plating layer on the front silver grid of a TOPCon solar cell to create a protective barrier that reportedly reduces corrosion ...
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