While the move to advanced process technologies has enabled levels of integration to reach new heights, engineers must now work harder than ever to realize those benefits. One of the key challenges ...
The semiconductor industry is shifting at 2nm from transistor scaling to chiplet-based architectures and advanced packaging. Performance gains are increasingly driven by heterogeneous integration ...
A new technical paper titled “Dual-Layer Thin-Film Transistor Analysis and Design” was published by researchers at Oregon State University and Applied Materials. “A set of analytical equations is ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results