GRENOBLE, France--(BUSINESS WIRE)--Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a breakthrough magnetic test head revolutionizing ...
The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...
The high costs of building, resourcing and operating a foundry fabricating integrated circuits are well known. Fabless companies avoid this capital cost and focus on design and innovation in their ...
With typical lot sizes of 25 wafers and finished wafer values ranging from $4,000 to $17,000, depending on complexity, a ...
The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the ...
SANTA CLARA, Calif.–Looking to reduce the soaring costs of IC test, Intel Corp. hopes to leverage its “casual learning algorithm” technology for wafer sort applications in the fab. Intel is looking to ...
The variety of different test methodologies combined with today�s mixture of memory devices creates a complex test profile. The manufacturing test floor hums with activity; a range of memory devices ...
Rapidus on Friday announced that it had begun prototyping of test wafers with 2nm gate-all-around (GAA) transistor structures at its IIM-1 facility in Japan. The company confirmed that early test ...
Across the semiconductor industry, ensuring cleanrooms and mini-environments are sufficiently monitored for particle sizes down to 100 nm is a common practice. Most industries have adopted this ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback