The release of Mastercam X3 by CNC Software (Tolland, CT) brings high-speed machining toolpaths into the realm of 2D. High-speed machining traditionally has been available in the Mastercam 3D ...
Researchers at Fudan University have achieved a breakthrough by fabricating the first Field-Programmable Gate Array (FPGA) based on wafer-scale two-dimensional (2D) semiconductor materials.
Tech Xplore on MSN
Direct approach can bond and debond 2D semiconductors without any glue-like materials
A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, ...
The race for faster, more efficient chips has reached a new milestone. Scientists at Shanghai’s Fudan University have unveiled the world’s first full-featured 2D flash chip, an engineering feat that ...
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