This white paper tackles the importance of epoxy-based underfill encapsulants in flip chip technology and semiconductor industry. This is a guide on selecting compounds and enhancing the reliability ...
With its Flip-Chip LED architecture enhancing brightness and heat dissipation, and COB packaging for added protection and ...
Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...
Multi-disciplinary team to further develop innovative approach to chip packaging and test manufacturing technology boosting efficiency and flexibility Part of ST’s strategic initiative on ...
IBM and SUSS MicroTec AG announced that they have signed an agreement to develop and commercialize IBM's next-generation,100 percent lead-free semiconductor packaging technology, C4NP. As part of the ...
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