Yahoo Finance

Ansys Thermal and Multiphysics Solutions Certified for Intel 18A Process and 3D-IC Designs

Ansys RedHawk-SC™ and Ansys Totem™ power integrity signoff platforms and Ansys HFSS-IC™ Pro electromagnetic simulation software are certified for Intel's 18A transistor process technology Ansys and ...
Yahoo Finance

Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions

RedHawk-SC, RedHawk-SC Electrothermal, and Totem are certified for TSMC's advanced silicon process A16™ with Super Power Rail, a best-in-class backside power delivery solution for analog/block-level ...
Nasdaq

Ansys 3D-IC Power Integrity and Thermal Solutions Certified for TSMC 3Dblox Reference Flow

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
Semiconductor Engineering

Accurate Thermal Analysis, Including Thermal Coupling Of On-Chip Hot Interconnect

Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power ...
EDN

ANSYS previews chip-package-system analysis for DesignCon

System design and system integration have taken on a whole new meaning with the latest trends in mobile and wearable computing. Integrating the compute power formally associated with super-computers ...