Abstract: Recent advances in Additive Manufacturing (AM) are transforming the development of flexible and reconfigurable RF electronics, driving innovation in applications such as the Internet of ...
Abstract: This paper presents design and implementation of a compact dual-band RF system-in-package (SiP) module for radar applications. Four S-band transceivers and one P-band transceiver are ...
Within the framework of the BEYOND5 project, CEA-Leti researchers have developed energy-efficient RF power modules based on SOI technology. This innovation won an award at the IEEE RFIC 2025 ...
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