Abstract: Through silicon via (TSV), serving as the vertical signal path in 3-D integrated circuits (3D-ICs), must be tested prior to die bonding (pre-bond). Most conventional pre-bond TSV test ...
Discover safe, step-by-step methods to run older Java apps on Windows 11 without compatibility issues. Learn about Java ...
usage: micro-minecraft-launcher-1.2.dev5-linux-x86_64 [-h] [-c CONFIG] [-d GAME_DIR] [-l] [-u USER] [--auth-uuid AUTH_UUID] [--auth-access-token AUTH_ACCESS_TOKEN ...
JDK 18 or higher for compiling and running the main application Or JRE 18 or higher for just running the jar file 2026-01: Added the Multi-agent A* (MAAStar) algorithm. 2025-06: Added the PaPS ...
Department of Chemistry and Chemical Biology, Indiana University−Purdue University Indianapolis, 402 North Blackford Street, Indianapolis, Indiana 46202, United States ...
Evolution and Analysis of Leakage Flux Path for Memory Machine With Variable Leakage Flux Capability
Abstract: To further expand the flux regulation (FR) range, variable leakage flux (LF) technology is introduced into the hybrid magnetic circuit memory machine (HMC-MM). This technology is realized by ...
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