Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
After you have written the code for some awesome application, you of course want other people to be able to use it. Although ...
Abstract: This paper presents a time-efficient approach to identify the worst bit based on crosstalk summation calculation, and subsequently generate the corresponding worst bit patterns using PDA ...
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